Umatshini wokusika weLaser
Intshayelelo yemveliso:
CNCumatshini wokusika we-laserisetyenziselwa ubukhulu becala ukusika ipleyiti kunye nokucutshungulwa, ngenkqubo ye-CNC, umgca othe tye kunye negophe lemilo engafanelekanga inokugawulwa kwaye ikrolwe kwipleyiti. Iyakwazi ukusika ipleyiti yentsimbi yekhabhoni eqhelekileyo, ipleyiti yensimbi engenasici, ipleyiti yobhedu, ubhedu olutyheli kunye ne-aluminium, kunye nezinye isinyithi ezingenakukwazi ukusika ngokulula ngendlela eqhelekileyo yokucubungula.
Inkcazo yobuGcisa:
1. Inkcazo engundoqo
|
| Into | Inkcazo | Iyunithi |
| 1 | Ubungakanani beShiti lokusika | 3000×1500 | mm |
| 2 | Ukubetha kwe-X Axis | 3000 | mm |
| 3 | Ukubetha kweY Axis | 1500 | mm |
| 4 | Ukubetha kwe-Z Axis | 280 | mm |
| 5 | Max. Isantya Sokutya | 140 | m/umz |
| 6 | Ukuchaneka kokusika | ±0.1 | mm/m |
| 7 | Ilinganiswe Amandla eLaser | 1000 | IN |
| 8 | Ukusika Ukutyeba (xa imeko efunekayo yokusika ifezekisiwe) | Intsimbi yeCarbon 0.5-12 | mm |
| Intsimbi yentsimbi 0.5-5 | mm | ||
| 9 | Ukutyeba okuZinzileyo kokusika | Intsimbi yeCarbon 10 | mm |
| Intsimbi yentsimbi 4 | mm | ||
| 10 | Igalelo lamandla | 32 | kVA |
| 11 | Ixesha lokutshintshiselana kwetafile yeshuttle | 10 | S |
| 12 | Ubunzima bomatshini | 8 | t |
2,SPI Laser Resonator
| Umzekelo | SPI-1000 |
| Igalelo lamandla | 3000W |
| Amandla emveliso | 1000W |
| Laser Power Uzinzo | |
| Ubude be-laser wave | 1075nm |
3,Inkqubo ye-CNC
| Into | Inkcazo |
| Inkqubo ye-CNC | Beckhoff |
| Iprosesa | I-Dual-core 1.9 GHz |
| Umthamo wememori yenkqubo | I4GB |
| Umthamo wememori ye-Hardware | 8GB |
| Bonisa uhlobo lwesikrini kunye nobukhulu | 19″ umbala wekristale yolwelo |
| Izibuko lonxibelelwano olusemgangathweni | USB2.0, Ethernet |
Ukusuka -
Ukusuka -