Intshayelelo yemveliso:
IFayibha yeCNCumatshini wokusika we-laser isetyenziselwa ubukhulu becala ukusika ipleyiti kunye nokucutshungulwa, ngenkqubo ye-CNC, umgca othe tye kunye negophe lemilo engafanelekanga inokugawulwa kwaye ikrolwe kwipleyiti. Iyakwazi ukusika ipleyiti yentsimbi yekhabhoni eqhelekileyo, ipleyiti yensimbi engenasici, ipleyiti yobhedu, ubhedu olutyheli kunye ne-aluminium, kunye nezinye isinyithi ezingenakukwazi ukusika ngokulula ngendlela eqhelekileyo yokucubungula.
Inkcazo yobuGcisa:
1 . Inkcazo engundoqo
| Into | Inkcazo | Iyunithi |
1 | Ubungakanani beShiti lokusika | 3000×1500 | mm |
2 | Ukubetha kwe-X Axis | 3000 | mm |
3 | Ukubetha kweY Axis | 1500 | mm |
4 | Ukubetha kwe-Z Axis | 280 | mm |
5 | Max. Isantya Sokutya | 140 | m/umz |
6 | Ukuchaneka kokusika | ±0.1 | mm/m |
7 | Ilinganiswe Amandla eLaser | 1000 | IN |
8 | Ukusika Ukutyeba (xa imeko efunekayo yokusika ifezekisiwe) | Intsimbi yeCarbon 0.5-12 | mm |
Intsimbi yentsimbi 0.5-5 | mm | ||
9 | Ukutyeba okuZinzileyo kokusika | Intsimbi yeCarbon 10 | mm |
Intsimbi yentsimbi 4 | mm | ||
10 | Igalelo lamandla | 32 | kVA |
11 | Ixesha lokutshintshiselana kwetafile yeshuttle | 10 | S |
12 | Ubunzima bomatshini | 8 | t |
2,SPI Laser Resonator
Umzekelo | SPI-1000 |
Igalelo lamandla | 3000W |
Amandla emveliso | 1000W |
Laser Power Uzinzo | |
Ubude be-Laser wave | 1075nm |
3.Inkqubo ye-CNC
Into | Inkcazo |
Inkqubo ye-CNC | Beckhoff |
Iprosesa | I-Dual-core 1.9 GHz |
Umthamo wememori yenkqubo | I4GB |
Umthamo wememori ye-Hardware | 8GB |
Bonisa uhlobo lwesikrini kunye nobukhulu | 19″ umbala wekristale yolwelo |
Izibuko lonxibelelwano olusemgangathweni | USB2.0, Ethernet |